Power Electronics Materials used in heat sink should have high melting point. high thermal conductivity. large surface area. All of these. high melting point. high thermal conductivity. large surface area. All of these. ANSWER DOWNLOAD EXAMIANS APP
Power Electronics A modern power semiconductor device that combines the characteristic of BJT and MOSFET is IGBT. MCT. FCT. GTO. IGBT. MCT. FCT. GTO. ANSWER DOWNLOAD EXAMIANS APP
Power Electronics For series connected SCR’s dynamic equalising circuit consists of series R and diode with C across R. R and C in series but with diode across R. series R and diode with C across R. R and C in series but with diode across C. series R and diode with C across R. R and C in series but with diode across R. series R and diode with C across R. R and C in series but with diode across C. ANSWER DOWNLOAD EXAMIANS APP
Power Electronics A triac has ___________ semiconductor layers. Four Two Five Three Four Two Five Three ANSWER DOWNLOAD EXAMIANS APP
Power Electronics The device that does not have the gate terminal is ___________. SCR Triac FET Diac SCR Triac FET Diac ANSWER DOWNLOAD EXAMIANS APP
Power Electronics 4 thyristors rated 200 V in series. The operating voltage of the string is 0.600 V. Derating factor of the string is 0.7. 0.75. 0.2. 0.25. 0.7. 0.75. 0.2. 0.25. ANSWER DOWNLOAD EXAMIANS APP
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